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1
 

An adaptive tabu search approach to cutting and packing problems
Harwig, John Michael

 
電子書

館藏地: 中央研究院
2
book jacket

Adhesion and subcritical debonding of polymer/inorganic interfaces in the absence of threshold
Sharratt, Bree M

 
電子書

館藏地: 中央研究院
3
book jacket

Adhesion mechanisms of nano-particle silver to electronics packaging materials
Joo, Sung Chul

 
紙本資料

館藏地: 中央研究院
4
book jacket

ALD Enabled Wafer Level Polymer Packaging for MEMS
Zhang, Yadong

 
紙本資料

館藏地: 資訊服務處
5
book jacket

Analyzing and improving viscoelastic properties of high density polyethylene
Ahmed, Reaj Uddin

 
紙本資料

館藏地: 資訊服務處
6
book jacket

Assessment of the environmental profile of PLA, PET, and PS clamshell containers using LCA methodology
Madival, Santosh

 
紙本資料

館藏地: 中央研究院
7
book jacket

Automated design process of sustainable industrial packaging
Chang, Ching-Jui

 
紙本資料

館藏地: 中央研究院
8
 

Basic and applied studies of electrically conductive adhesives
Li, Li

 
電子書

館藏地: 中央研究院
9
book jacket

Characterization and reliability analysis of wire bonds inside a package subjected to cyclic loading
Silva, Peterson S

 
電子書

館藏地: 中央研究院
10
book jacket

Chip package interaction (CPI) and its impact on the reliability of flip-chip packages
Zhang, Xuefeng

 
紙本資料

館藏地: 資訊服務處
11
book jacket

Comparative performance of PLA and PET bottles for alcohol and sugar acid solution
Rawal, Praveen

 
紙本資料

館藏地: 中央研究院
12
book jacket

Comparison of different packaging materials to determine their effect on availability and effectiveness of 1-methylcyclopropene
Rodriguez, Luis C

 
電子書

館藏地: 中央研究院
13
 

Constitutive modeling of woven-fabric composites for concurrent design
Agarwal, Rakesh K

 
電子書

館藏地: 中央研究院
14
 

Correlation of analyses of odor profiles of HDPE films coated with different adhesives using electronic nose, sensory evaluation, and GC-MS
Xiong, Li

 
電子書

館藏地: 中央研究院
15
 

Design and characterization of microfabricated three-dimensional millimeter-wave components
Vanhille, Kenneth J

 
電子書

館藏地: 中央研究院
16
book jacket

Design for the environment in electronics manufacturing: Product optimization for waste stream minimization
Siddhaye, Sudarshan Vishwas

 
電子書

館藏地: 中央研究院
17
book jacket

Development of a high current high temperature SiC MOSFET based solid-state power controller
Guo, Yuanbo

 
紙本資料

館藏地: 資訊服務處
18
book jacket

Development of active packaging for cosmetics and study of the migration of oxygen scavenger
Shin, Yangjai

 
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館藏地: 資訊服務處
19
book jacket

Development of parylene/PDMS bi-layer coating and characterization using nanoindentation
Lee, Hyungsuk

 
電子書

館藏地: 中央研究院
20
book jacket

The effect of bio-based films on quality and shelf life of fresh celery
Ifezue, Chike

 
紙本資料

館藏地: 中央研究院
21
book jacket

The effect of packaging attributes on consumer perception of cherry juice
Whaling, Audrey Michael

 
電子書

館藏地: 中央研究院
22
book jacket

The effect of surface treatments and modified atmosphere packaging (MAP) on the quality of fresh cut sliced Anjou pears
Siddiq, Raafia

 
紙本資料

館藏地: 中央研究院
23
book jacket

The effect of tag orientation and package content on the readability of radio frequency identification (RFID) transponders
Tazelaar, Jeffrey Robert

 
電子書

館藏地: 中央研究院
24
book jacket

The effects of including/excluding attributes on consumer choice: An empirical study of new food packaging
Zhu, Bichen (Wade)

 
電子書

館藏地: 中央研究院
25
book jacket

The effects of temperature and humidity on cushioning properties of expanded polylactic acid foam
Szymanski, Jason

 
紙本資料

館藏地: 中央研究院
26
book jacket

Electrical interconnect of components transferred by fluidic microassembly using capillary forces
Scott, Karen Lemay

 
電子書

館藏地: 中央研究院
27
book jacket

Electromigration and thermomigration reliability of lead-free solder joints for advanced packaging applications
Chae, Seung-Hyun

 
紙本資料

館藏地: 資訊服務處
28
book jacket

Expanded polystyrene foam design with emphasis on nonimpact cushioning applications
Rusmeehatthakarn, Pichai

 
電子書

館藏地: 中央研究院
29
book jacket

Finite element analysis of moisture and thermal induced stress in flip chip packages
Ghosh, Santanu

 
電子書

館藏地: 中央研究院
30
 

Flip chip assembly in air from manufacturing and reliability perspectives
Mun, Ji Hyon

 
電子書

館藏地: 中央研究院
31
book jacket

Flow boiling heat transfer from plain and microporous surfaces
Gang, Li

 
紙本資料

館藏地: 資訊服務處
32
book jacket

Flying the "unfriendly skies": Flight attendant activism, 1964-1982
Maley, Carney

 
紙本資料

館藏地: 中央研究院
33
 

Fountain solution pH and conductivity changes caused by paper extractables during offset printing
Cox, Douglas Edward

 
電子書

館藏地: 中央研究院
34
book jacket

High barrier multilayer packaging by the coextrusion method: The effect of nanocomposites and biodegradable polymers on flexible film properties
Thellen, Christopher T

 
紙本資料

館藏地: 中央研究院
35
book jacket

Low temperature wafer scale MEMS packaging and intrapackage humidity monitoring
Hwang, Taejoo

 
電子書

館藏地: 中央研究院
36
book jacket

MEMS packaging: Fluxless soldering and reliability assessment
Patil, Amit

 
電子書

館藏地: 中央研究院
37
book jacket

A model for the implementation of a radio frequency identification system into a warehouse environment
Ryan, Michelle Renee

 
電子書

館藏地: 中央研究院
38
book jacket

Modeling and characterization for small-scale packaging applications
Yang, Quan

 
電子書

館藏地: 中央研究院
39
book jacket

A new simulation method providing shock mount selection assurance
Talley, Michael A

 
電子書

館藏地: 中央研究院
40
 

Nodal topology in compact thermal models
Greisen, Daniel H

 
電子書

館藏地: 中央研究院
41
book jacket

Nonconscious factors influencing attitude/behavior/judgment of products and sequences
Ghoshal, Tanuka

 
紙本資料

館藏地: 中央研究院
42
 

A novel solid state general illumination source
Nicol, David B

 
電子書

館藏地: 中央研究院
43
book jacket

Persuasive packaging: An eye-tracking approach to design
Hurley, Rupert Andrew

 
紙本資料

館藏地: 資訊服務處
44
book jacket

Prognostics demonstration of electronic components subjected to vibration environment of a light military tactical vehicle
Yu, Alan T

 
電子書

館藏地: 中央研究院
45
book jacket

Prognostics of solder joint reliability under vibration loading using physics of failure approach
Gu, Jie

 
紙本資料

館藏地: 中央研究院
46
book jacket

Radio frequency identification transponder performance on refrigerated and frozen beef loin muscle packages
Onderko, John Christian

 
電子書

館藏地: 中央研究院
47
book jacket

Refurbished electronics assembly equipment: Case studies for R&D and manufacturing
Kane, Amol S

 
電子書

館藏地: 中央研究院
48
book jacket

Reliability quantification of printed circuit boards subjected to thermal and vibration loads
Wei, Zishan

 
電子書

館藏地: 中央研究院
49
book jacket

Safety studies with proteolytic Clostridium botulinum in high-moisture bakery products packaged under modified atmospheres
Phillips, Daphne

 
電子書

館藏地: 中央研究院
50
book jacket

The shelf life and in package cooking of ready-to-eat fresh asparagus in microwaveable MAP and VSP tray systems
Benyathiar, Patnarin

 
紙本資料

館藏地: 中央研究院
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